发明名称 Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
摘要 A reinforcement structure to protect an integrated circuit module located within a smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is positioned within the smart card and has a cavity extending partially through the reinforcement structure or an opening which extends completely through the reinforcement structure. The integrated circuit module is positioned in the cavity or opening of the reinforcement structure. When the integrated circuit module is positioned in a cavity, the integrated circuit module is completely disposed in the cavity. An additional layer can be formed on the card to enclose the integrated circuit module and reinforcement structure. The reinforcement structure, which can have various shapes, relieves stress on the integrated circuit module during bending and torsion of the card.
申请公布号 US5682294(A) 申请公布日期 1997.10.28
申请号 US19960688080 申请日期 1996.07.29
申请人 US3, INC. 发明人 HOREJS, JR., CHARLES F.;TEMPLETON, JR., THOMAS H.
分类号 G06K19/077;H05K1/02;H05K3/00;(IPC1-7):H05K1/18 主分类号 G06K19/077
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