| 摘要 |
The printed circuit comprises connection pads emerging on a surface of the integrated circuit, which is coated with a first insulating layer (5) comprising apertures opposite the connection pads, at least one conductive track (7) extending from the first insulating layer and having one end connected to one of the integrated circuit connection pads, a second insulating layer (8) covering the first insulating layer and comprising apertures (9) opposite each conductive track (7) of the first layer and opposite the connection pads not connected to a track (7), and at least one repositioning track (10) extending on the second insulating layer (8) and having one end connected to a track (7) of the first insulating layer.
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