Abrasive particle, method for producing the same, and method of use of the same

摘要

Disclosed is an abrasive particle having an average particle size of not more than 2 mu m and comprising 100 parts by weight of aluminum oxide and/or silicon oxide and 5 to 25 parts by weight of cerium in the form of cerium oxide. A method for producing the same, and a method for planarizing an insulating film on a semiconductor substrate using the abrasive particles are also disclosed.