| 摘要 |
A semiconductor device is manufactured by using a lead frame having a die pad (24) and a plurality of leads (25) arranged outside the die pad, mounting a semiconductor chip (11) on the die pad, and covering the die pad and its peripheral portion with resin. The die pad (24) is formed separately from the main portion of the lead frame having the leads, which is shaped into a flat plate and whose all edge corners are rounded. The die pad is rounded when formed with ceramic or resin, or is formed with metal and rounded through honing. <IMAGE> |
