THIN FILM MAGNETIC HEAD TIP AND MANUFACTURING METHOD THEREFOR
摘要
A thin film magnetic head tip, and a method for manufacturing the thin film magnetic head tip by a wafer process, are provided. A base (120) material is stacked on a wafer (100) and a core (110) is stacked partially within the base material to form an azimuth groove (140). Conductive points (210) are within a plurality of holes passed through the wafer (100). A coil (130) is stacked being connected to the conductive points (210), and the surface of the core (110) with the azimuth angle and the base (120) are rounded.
申请公布号
WO9800840(A1)
申请公布日期
1998.01.08
申请号
WO1997KR00113
申请日期
1997.06.13
申请人
SAMSUNG ELECTRONICS CO., LTD.;LEE, JAE, SOO;KIM, SANG, JOON;CHUNG, BYUNG, SOO