| 摘要 |
A semiconductor package of the present invention resolves problem of a lead deformation when treated by using a separate clamp lead for packaging, improves packaging efficiency by minimization of the package, and reduces overall packaging thickness by adhering a package body completely on a substrate. Specifically, the package body(10) is put on the substrate(5) and the clamp lead for packing(20) being positioned between a lead(2c) exposed to an upper surface of the package body(10) and a pattern of the substrate(5), thereby being fixed by soldering.
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