METHOD FOR MINIMIZING WARP AND DIE STRESS IN THE PRODUCTION OF AN ELECTRONIC ASSEMBLY

摘要

A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die (18) to a package (12), and connecting an opposite surface of the die to a lid (32) disposed over a constraining ring (22) that is mounted to the package. The lid has a size, shape and coefficient of thermal expansion (CTE) selected to generate a bending moment that opposes bending moments resulting from connecting the die to the package.