发明名称 |
Integrated circuit chip package having configurable contacts and a removable connector |
摘要 |
An integrated circuit chip package having an electrical contact configurable for either signal or power/ground and a method for constructing the integrated circuit chip package are disclosed. The integrated circuit chip package includes a substrate for supporting an integrated circuit chip and a dedicated conductor for supplying voltage to the integrated circuit chip. A configurable contact is attached to a surface of the substrate. The integrated circuit chip package further includes a signal connection for electrically connecting a signal connector of an integrated circuit chip and the configurable contact. A removable connector electrically connects the configurable contact and the dedicated conductor, thereby enabling the configurable contact to be configured as either a signal or power/ground contact depending upon the absence or presence of the electrical connection between the configurable contact and the dedicated conductor provided by the removable connector.
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申请公布号 |
US5763947(A) |
申请公布日期 |
1998.06.09 |
申请号 |
US19960594201 |
申请日期 |
1996.01.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTLEY, GERALD K. |
分类号 |
H01L23/498;H01L23/50;H01L23/538;(IPC1-7):H01L23/053;H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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