| 发明名称 |
LIGHT EMITTING DIODE FOR SURFACE MOUNT TECHNOLOGY, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE MODULE |
| 摘要 |
A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on a portion of the first semiconductor layer, a second semiconductor layer disposed on the active layer, a reflection pattern disposed on a portion of the second semiconductor layer, and a first insulating layer including a first portion having a first thickness and a second portion having a second thickness different from the first thickness, in which the first portion is disposed on the reflection pattern or the first semiconductor layer and the second portion is disposed on the second semiconductor layer. |
| 申请公布号 |
US2016276542(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615171431 |
申请日期 |
2016.06.02 |
| 申请人 |
Seoul Viosys Co., Ltd. |
发明人 |
Chae Jong Hyeon;Jang Jong Min;Roh Won Young;Suh Dae Woong;Kang Min Woo;Lee Joon Sub;Kim Hyun A |
| 分类号 |
H01L33/40;H01L33/00;H01L33/12;H01L33/62;H01L33/06;H01L33/32 |
主分类号 |
H01L33/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED), comprising:
a substrate; a first semiconductor layer disposed on the substrate; an active layer disposed on a portion of the first semiconductor layer; a second semiconductor layer disposed on the active layer; a reflection pattern disposed on a portion of the second semiconductor layer; and a first insulating layer comprising a first portion having a first thickness and a second portion having a second thickness different from the first thickness, wherein:
the first portion is disposed on the reflection pattern; andthe second portion is disposed on the second semiconductor layer. |
| 地址 |
Ansan-si KR |
