发明名称 SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME, AND LIGHT EMITTING DEVICE
摘要 According to one embodiment, semiconductor light emitting element includes: a substrate having a first surface and a second surface on an opposite side of the first surface; an insulating layer provided on the second surface of the substrate; a first metal layer provided on the insulating layer; a semiconductor light emitting unit provided on the first metal layer, the semiconductor light emitting unit including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the second semiconductor layer being electrically connected to the first metal layer; and a first electrode layer provided on the first surface of the substrate, the first electrode layer extending in the substrate and in the insulating layer, and the first electrode layer being electrically connected to the first metal layer.
申请公布号 US2016276532(A1) 申请公布日期 2016.09.22
申请号 US201615061398 申请日期 2016.03.04
申请人 Kabushiki Kaisha Toshiba 发明人 MORI Kentaro;Suzuki Takeyuki;Matsuo Mie;Sekiguchi Masahiro;Kaga Koji
分类号 H01L33/12;H01L33/22;H01L33/32;H01L33/00;H01L33/48;H01L33/60;H01L33/62;H01L33/06;H01L33/40 主分类号 H01L33/12
代理机构 代理人
主权项 1. A semiconductor light emitting element comprising: a substrate having a first surface and a second surface on an opposite side of the first surface; an insulating layer provided on the second surface of the substrate; a first metal layer provided on the insulating layer; a semiconductor light emitting unit provided on the first metal layer, the semiconductor light emitting unit including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the second semiconductor layer being electrically connected to the first metal layer; and a first electrode layer provided on the first surface of the substrate, the first electrode layer extending in the substrate and in the insulating layer, and the first electrode layer being electrically connected to the first metal layer.
地址 Minato-ku JP