| 摘要 |
PROBLEM TO BE SOLVED: To provide a scribing device capable of simply dividing a thin brittle material substrate at a low cost when especially, divided.SOLUTION: A method for dividing a brittle material substrate G along a predetermined division line comprises: the first step of closely contacting a first substrate G1 with a second substrate G2 having a linear expansion coefficient larger than that of the first substrate G1 and placing them on a work table; the second step of forming initial cracks in the first substrate G1; the third step of irradiating and heating the substrate having the formed initial cracks with a laser beam along the predetermined division line, and forming cracks inside the first substrate G1 and the second substrate G2 along the predetermined division line; and the fourth step of pressing both sides of the predetermined division line to divide the first substrate G1 and the second substrate G2 along the predetermined division line. |
