Chipmodul für eine Chipkarte

摘要

the chip module has a carrier substrate (2), at least one IC (4) on the carrier substrate and a cover (50 pref. pressed onto the substrate. The substrate has at least one opening (12) whose edge region (14) is shaped at least in sections to form at least one reverse cut (11. The covering material flows into the opening and reverse cut. The reverse cut is formed by making depressions in the rear (6) of the carrier film and corresp. raised parts (10) on the front side so that the deformed edge region protrudes over the plane spanned by the carrier substrate. At least part of the upward protruding edge region (14) is at an angle less than 90 degrees to the bounding flat edge region (13).