| 摘要 |
PROBLEM TO BE SOLVED: To form an LSI into an LSI, which is good in packaging efficiency, by a method wherein first and second semiconductor chips laminated in such a way that the fellow electrode pads of the chips are electrically connected with each other are encapsulated in a single integrated package. SOLUTION: A first LSI chip 6 is mounted on an island 5 and, moreover, a second LSI chip 7 is mounted on the island 5 in such a way as to opposite to the chip 6. Moreover, external pads provided on the chip 7 are electrically connected with external terminals 2 to encapsulate these chips in a plastic mold 1. That is, the chips 6 and 7 laminated in such a way that the fellow electrode pads of the chips 6 and 7 are electrically connected with each other are encapsulated in the single integrated package. In such a way, the chip 7 is mounted on the chip 6, and the fellow internal pads of the chips 6 and 7 are electrically connected with each other to constitute an LSI into a two-step structure.
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