Methods and apparatus for measuring and dispensing processing solutions to a CMP machine

摘要

Methods and apparatus for measuring and controlling the flow rates of processing solutions to a CMP machine during the polishing and planarization process. The apparatus comprises a processing solution source, a processing solution dispensing system for applying the solution to the CMP machine, a mechanism for transferring the processing solution from the solution source to the dispensing system, and a metering or sensing system for accurately measuring the amount of processing solution actually dispensed to the CMP machine. Preferably, the metering system comprises a coriolis mass flow meter and a controller for controlling its operation. The metering system may interface with the CMP machine controller in a feed-back loop configuration so that the actual flow rates of the solutions may be controlled in real time.