发明名称 Method of aperturing thin sheet materials
摘要 A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) placing the adhesive-coated thin sheet material on a patterned anvil having a pattern of raised areas wherein the height of the raised areas is equal to or less than the thickness of the thin sheet material and the adhesive; and (b) subjecting the thin sheet material to a sufficient amount of sonic vibrations to aperture the thin sheet material and the adhesive; and whereby the thin sheet material and the adhesive is apertured in a pattern generally the same as the pattern of raised areas on the patterned anvil.
申请公布号 US5879494(A) 申请公布日期 1999.03.09
申请号 US19980045606 申请日期 1998.03.20
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 HOFF, RANDY A.;LOUKS, JOHN W.;JACOBSON, RICHARD L.
分类号 B29C65/08;(IPC1-7):B32B31/18 主分类号 B29C65/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利