| 摘要 |
PROBLEM TO BE SOLVED: To avoid absorption of water content from a board back surface and peeling and cracking of the board due to the reflow heat of a solder at mounting, by covering external terminal mounting face of the board with a metal plate. SOLUTION: A semiconductor device comprises a semiconductor element 1 which is mounted on one main plane of a printed board 2 with a mounting member 3, electrically connected to a conductor wiring 6 on the board 2 through bonding wires 4 and sealed with a seal resin 5. Solder ball-made outer terminals 9 are mounted on the back side of the board 2, exposed from the resin 5 and disposed like a lattice only at the back side periphery of the board 2. A metal plate 8 is fixed to the back side of the board 2 inside the external terminals 9 corresponding to the mounting part of the semiconductor element, thereby avoiding absorbing the water content of the board 2 and minimizing the reflow crack on mounting. |
