MULTILAYERED WIRING STRUCTURE AND ITS MANUFACTURE,申请号JP19970266693-传众专利搜索

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发明名称	MULTILAYERED WIRING STRUCTURE AND ITS MANUFACTURE
摘要
申请公布号	JPH11111842(A)	申请公布日期	1999.04.23
申请号	JP19970266693	申请日期	1997.09.30
申请人	SONY CORP	发明人	MIYAMOTO TAKAAKI
分类号	H01L21/285;H01L21/28;H01L21/768;(IPC1-7):H01L21/768	主分类号	H01L21/285
代理机构		代理人
主权项
地址

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