MOUNTING STRUCTURE OF LEADED ELECTRONIC COMPONENT WHICH REDUCES OCCURRENCE OF BLOW HOLE

摘要

In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

主权项

1. A leaded electronic component mounting structure in which a leaded electronic component and a printed wiring board are electrically and mechanically joined by inserting a lead of the leaded electronic component into a through hole provided in the printed wiring board and performing immersing into molten solder, the leaded electronic component mounting structure comprising:
a surface mount component mounted on a surface mount component pad provided on the printed wiring board; and the leaded electronic component placed over the surface mount component, wherein the surface mount component and the surface mount component pad form a tunnel-shaped air passage connecting a space formed by the leaded electronic component and the printed wiring board to an outside.