MULTILAYER CIRCUIT BOARD AND INSPECTION APPARATUS INCLUDING THE SAME

摘要

A multilayer circuit board 1 includes a ceramic multilayer body 2, in which a plurality of ceramic layers 2a to 2d are stacked, and a resin multilayer body 3 which is stacked on the ceramic multilayer body 2 and in which a plurality of resin insulating layers 3a to 3c are stacked, wherein the peripheral portion of the resin multilayer body 3 is thinner than the central portion. Consequently, residual stress that acts on the peripheral portion of the interface serving as a base point of interfacial peeling between the resin multilayer body 3 and the ceramic multilayer body 2 can be relaxed and, thereby, interfacial peeling between the resin multilayer body 3 and the ceramic multilayer body 2 can be reduced. Also, the volume of the resin insulating layer 3 decreases by making the peripheral portion of the resin insulating layer 3 thin.

主权项

1. A multilayer circuit board comprising:
a ceramic multilayer body having a plurality of ceramic layers stacked; and a resin multilayer body stacked on the ceramic multilayer body and having a plurality of resin insulating layers stacked, wherein a peripheral portion of the resin multilayer body is thinner than a central portion of the resin multilayer body.