发明名称 ELECTROLYTE FOR DEPOSITION OF COPPER-INDIUM ALLOY
摘要 FIELD: electrolysises for electrodeposition of copper-indium alloy. SUBSTANCE: electrolyte for deposition of coatings from copper-indium alloy has copper and indium sulfates, trilon B, ammonium acetate and organic additive with definite amounts of components. Electrolyte allows deposition of light, semilustrous coatings with high corrosion resistance. EFFECT: higher efficiency. 1 tbl
申请公布号 RU2134734(C1) 申请公布日期 1999.08.20
申请号 RU19980110595 申请日期 1998.06.02
申请人 TJUMENSKIJ GOSUDARSTVENNYJ NEFTEGAZOVYJ UNIVERSITE 发明人 POVETKIN V.V.;IVANOVA T.E.;VEDERNIKOVA A.V.
分类号 C25D3/58;(IPC1-7):C25D3/58 主分类号 C25D3/58
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