发明名称 |
ELECTROLYTE FOR DEPOSITION OF COPPER-INDIUM ALLOY |
摘要 |
FIELD: electrolysises for electrodeposition of copper-indium alloy. SUBSTANCE: electrolyte for deposition of coatings from copper-indium alloy has copper and indium sulfates, trilon B, ammonium acetate and organic additive with definite amounts of components. Electrolyte allows deposition of light, semilustrous coatings with high corrosion resistance. EFFECT: higher efficiency. 1 tbl
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申请公布号 |
RU2134734(C1) |
申请公布日期 |
1999.08.20 |
申请号 |
RU19980110595 |
申请日期 |
1998.06.02 |
申请人 |
TJUMENSKIJ GOSUDARSTVENNYJ NEFTEGAZOVYJ UNIVERSITE |
发明人 |
POVETKIN V.V.;IVANOVA T.E.;VEDERNIKOVA A.V. |
分类号 |
C25D3/58;(IPC1-7):C25D3/58 |
主分类号 |
C25D3/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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