| 摘要 |
The micromechanical structure comprises a substrate (1), at least one membrane (3) arranged above the substrate, a hollow space (6) , which is arranged between the membrane and substrate, at least one sacrificial layer (7) acting as an overlay for the membrane, and an end structure (2), which covers the wafer surface and a partial region of the membrane. The end structure is received in the region of the membrane, such that an opening (8) is located above the membrane. The opening extends, at least partly, as far as the membrane. The diameter (dH) of the hollow space over the whole periphery of the hollow space (6) is less than the diameter(dA) of the opening. The membrane has a hole, which is closed by a lid.
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