METHOD FOR MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE

摘要

A method for manufacturing an electronic substrate includes providing a substrate and forming a buffer layer on the substrate. A connection pad is formed on the buffer layer. An electrically insulating layer is formed on the buffer layer. A connection hole is defined in the electrically insulating layer. A connection line made of metal is formed on the electrically insulating layer and extends into the connection hole to electrically couple with the connection pad. An electrically insulating cover is formed on the electrically insulating layer to cover the connection line. A light irradiation is applied to the electrically insulating cover through a mask which has a first translucent region located corresponding to the connection line and a second translucent region located beside the connection line. A transmittance of the first translucent region is lower than a transmittance of the second translucent region.

主权项

1. A method for manufacturing an electronic substrate comprising:
providing a substrate and forming at least one first electrically conductive component on the substrate; forming an electrically insulating layer on the substrate to cover the at least one first electrically conductive component; defining at least one connection hole in the electrically insulating layer to expose the at least one first electrically conductive component; forming at least one second electrically conductive component on the electrically insulating layer, the at least one second electrically conductive component extending into the at least one connection hole to electrically couple with the at least one first electrically conductive component, the at least one second electrically conductive component being light reflective; forming an electrically insulating cover on the electrically insulating layer to cover the at least one second electrically conductive component; irradiating the electrically insulating cover with light through a mask, the mask having a first translucent region located corresponding to the at least one second electrically conductive component and a second translucent region located beside the at least one second electrically conductive component, the first translucent region having a transmittance lower than a transmittance of the second translucent region; and developing the electrically insulating cover by using a photoresist developer.