| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device capable of simplifying a manufacturing process by eliminating a welding process, improving assembling workability, and downsizing by disposing electronic components constituting a protection circuit or a control circuit of a semiconductor element in an area near a semiconductor module.SOLUTION: A power conversion device 1 includes: a plurality of semiconductor modules 10; a coupling member 20; and a bus bar 31. The semiconductor module 10 includes a plurality of power terminals 12 on which through-holes 12a are formed. The coupling member 20 includes: a plurality of conductive members 21 to which the power terminals 12 are connected; and a holding member 22, for holding the conductive members 21. Electronic components 40, constituting part of a protection circuit or a control circuit, are mounted on the coupling members 20. The power terminals 12 are connected to first surfaces 211b to 214b of the conductive members 21 and bus bars 31 to 33. The bus bars 31 to 33 are connected to second surfaces 211a to 213c. The first surfaces 211b to 214b are positioned on the same plane (U).SELECTED DRAWING: Figure 2 |
