发明名称 SCATTERING OF SOLID PREPARATION
摘要 PROBLEM TO BE SOLVED: To provide a sprinkling method for solid preparation that solves the problems on low-volume sprinkling, permits easy control of the throughput rate independently from the particle sizes of the solid preparation in the area of the low throughput operation as the residual quantity of the preparation is observed in the vessel. SOLUTION: A blast tube 1 has a hole 2 bored and a bottle 3 filled with a solid preparation is fitted to the hole 2 from the outside. A plate 5 is attached on the upstream side of the hole 2 so that it may move in the range of from 0 deg. to 90 deg. to the direction of the air flow and the solid preparation in the bottle is sprinkled by air-blowing through the tube before the plate 5 is set at a suitable angle. The attachment for sprinkling the solid preparation is attached to the hole 2 bored on the air-flowing tube 1 and the movable plate 5 is held to the inside of the tube at its one end and an plate angle adjuster 6 (one end of a string) is attached to the other end of the plate 5.
申请公布号 JP2000032899(A) 申请公布日期 2000.02.02
申请号 JP19980203647 申请日期 1998.07.17
申请人 KUMIAI CHEM IND CO LTD 发明人 FUJITA SHIGEKI;NAKAMURA KANJI
分类号 A01C15/04;A01M9/00;B05B7/14;B05B7/24;(IPC1-7):A01M9/00 主分类号 A01C15/04
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