发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having excellent curability, capable of being stored at room temperature and not always needing an organic solvent by adding a specific compound as a curing agent to a specified epoxy resin. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin having two or more epoxy groups on the average in the molecule (for example, a bisphenol A type epoxy resin) and (B) the salt of an imidazole compound (for example, 2-methylimidazole) with 1,3,5-tris(2-carboxyethyl)isocyanurate as a curing agent in an epoxy group/carboxy group equivalent ratio of 1 to 15. The salt of component B is preferably prepared, for example, by thermally dissolving the 1,3,5-tris(2-carboxyethyl)isocyanurate in a solvent such as methanol, adding the imidazole compound to the solution, cooling the reaction solution, recovering the deposited crystals and subsequently recrystallizing the recovered crystals in a solvent such as methanol.
申请公布号 JP2000038438(A) 申请公布日期 2000.02.08
申请号 JP19980207583 申请日期 1998.07.23
申请人 SHIKOKU CHEM CORP 发明人 SAKAMOTO YUKIHIRO
分类号 C08L63/00;C08G59/40;C08G59/56;(IPC1-7):C08G59/56 主分类号 C08L63/00
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