HIGH PERFORMANCE FLIP CHIP PACKAGE

摘要

An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die (102) is attached to a carrier (100) (or substrate) that has a cavity surrounding the die (102). Direct connection of the active surface of the silicon die (102) to the printed circuit board is then made by an array of solder bumps (108) that is distributed across the surface of the die (102) as well as the edges of the carrier (100) surrounding the die (102).