| 摘要 |
FIELD: radio engineering, electronics. SUBSTANCE: invention is related to manufacture of articles with film resistive elements. Two or more resistive layers of same material are deposited one after another on dielectric substrate. Thermal treatment of preceding layers is conducted before each deposition of due resistive layer, configuration of resistors and contacts is formed, then cyclical thermal treatment is carried out in the course of 25-30 min by way of sequential placement and curing of substrate in liquid nitrogen, organic solvent and in air. Time of holding for each operation is equal to 30-60 s. EFFECT: increased reproducibility of key parameters of resistive elements, expanded technological capabilities in unification of conditions of deposition and treatment of resistive layers. 1 tbl
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