| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly heat-resistant composition useful for sealing semiconductor components by mixing a stilbene skeleton-containing epoxy resin and an epoxy resin curing agent as the essential components. SOLUTION: The stilbene skeleton-containing epoxy resin is a compound represented by the formula (wherein R1 to R8 are each hydrogen, a halogen, an alkyl or a cycloalkyl). The compound of the formula is desirably the one in which the two aryl groups are different from each other or one made from 2,6-xylenol and 3-methyl-6-t-butylphenol. The epoxy resin curing agent used is exemplified by tetrahydrophthalic anhydride, diethylenetriamine or phenol. More desirably, the composition further contains an inorganic filler as an essential component. The filler is exemplified by silica, alumina or titanium white. A semiconductor sealed with this composition has excellent reliability such as heat resistance.
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