发明名称 MATERIAL FOR FORMING MULTILAYER BOARD, AND MULTILAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide a material for forming multilayer boards high in processability and strength. SOLUTION: This material for forming multilayer boards is formed by impregnating an alkalifree glass cloth with a thermosetting resin to form a prepreg and by curing the prepreg and has a >=2,400 kgf/mm2 flexural elasticity at 20 deg.C and a 10-13 ppm/ deg.C coefficient of linear expansion in the planar direction. The above material does not cause a large flexure in processing such as through hole formation, circuit formation, electronic parts mounting, or the like, is easy to be processed and never causes breakage such as crazing or the like.
申请公布号 JP2000063545(A) 申请公布日期 2000.02.29
申请号 JP19980240587 申请日期 1998.08.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TAKADA TOSHIHARU;SAGARA TAKASHI
分类号 C08J5/24;B32B5/28;B32B17/04;(IPC1-7):C08J5/24 主分类号 C08J5/24
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