| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damage of particles when the particles are adhered and to reduce cost by forming a heat generation resistor provided with a route supplying power on a silicon substrate, permitting a particle adhesion member where adhesion appears with the heat generation resistor and transferring the particles. SOLUTION: A particle adhesion device 1 is provided with a silicon substrate 3 fixed to a base material 2. A particle adhesion part 4 is provided with a heat insulating member 5, a heat generation resistor 5 and a particle adhesion member 7. At the time of making particles adhere to the particle adhesion member 7, the particles are brought into contact with a face from which the particle adhesion member 7 is exposed. Power is supplied to an electrode provided for the heat generation resistor 6 and adhesion is made to appear in the particle adhesion member. Even if the particles are adhered to a surface layer 10, the particles adhered to the particle adhesion member 7 are left as they are, and the particles adhered to the surface layer 10 can be dropped by air blow and the like. Then, the damage of the particles can be prevented without the need of a mask. Adhered adhesive is not required and cost can be reduced.
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