| 摘要 |
PROBLEM TO BE SOLVED: To provide a surge absorber that can facilitate sealing by preventing displacement in overlapping state of substrates, having a discharge chamber of a sealing gas atmosphere, and moreover can be easily and inexpensively manufactured by eliminating labor and cost for forming a micro gap with a laser. SOLUTION: This absorber 10 has a constitution, in which cap electrodes 7A, 7B are mounted to the both end surfaces of a chip-type element 5 formed by integrating an alumina substrate 1, on which a conductive coat 2 is formed and an alumina substrate 3 in which a groove 4 is formed. The inside of the groove 4 is a sealed gas atmosphere, glass layers 6 for the cap electrodes 7A, 7B joining is provided so that the conductive coat 2 is exposed on an end surface of the chip-type element 5, and distances between this conductive coat 2 and the cap electrodes 7A, 7B function as discharge distances, and absorbs surge.
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