| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture method of a semiconductor device, which prevents flowing-out of sealing resin to the external mounting surface of an inner lead and can decrese the defective mounting. SOLUTION: A signal-sided resin sealing die 20 comprising the combination of an upper mold 20A having a sealing-resin filling cavity 22 filling the sealing resin and a lower mold 20B having a ring-shaped projection 25 in the minute height, which protrudes at a width narrower than that at the upper-mold patting surface 23 at a part in contact with the upper mold patting part 23, is prepared. A semiconductor-element mounting unit frame 18 is pushed and fixed by the upper-mold patting surface 23 and a lower-mold patting surface 24. In a state in which an external mounting surface 11A of an inner lead 11 is pushed downwards, sealing resin 21 is injected into a sealing-resin filling cavity 22. Thus, a semiconductor package unit, where the external mounting surface 11A is exposed to a bottom surface part 26 of sealing resin 21, is manufactured.
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