发明名称 TUBULAR MEMBER FOR SEMICONDUCTOR HEAT TREATMENT OVEN
摘要 PROBLEM TO BE SOLVED: To adapt to a rapid temperature change by providing a plurality of fins on the surface of a pipe body in the axial direction of the pipe body. SOLUTION: A tubular member for a semiconductor heat treatment oven, for example a reactor core tube 1, is made of Si-impregnated SiC sintered body, and the reactor core tube 1 is provided with a tube body 2 in a closed-end cylindrical shape, an outer fin 3 that is provided on the surface, for example an outer surface 2o, of the tube body 2, and an inner fin 4 that is provided on an inner surface 2i. Each plurality of outer fins 3 and inner fins 4 are in axial direction (longer direction) of the pipe body 2 and are provided on the outer surface 2o and the inner surface 2i so that they reach a bottom surface part 6 from an opening 5, and the length of the outer fin 3 and the inner fin 4 is 20% or longer than the length of the pipe body 2. The radius of the pipe body 2 in a cylindrical shape is, for example, 193 mm, the coating thickness of the pipe body ranges from 2 to 7 mm, and the total of the coating thickness of the pipe body 2 and the sum of the height of the outer fin and that of the inner fin 4 ranges from 7 to 14 mm.
申请公布号 JP2000077344(A) 申请公布日期 2000.03.14
申请号 JP19980250044 申请日期 1998.09.03
申请人 TOSHIBA CERAMICS CO LTD 发明人 MATSUYAMA TOYOKAZU;HIKITA JUN
分类号 H01L21/22;(IPC1-7):H01L21/22 主分类号 H01L21/22
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