发明名称 Laser method for plating vias
摘要 The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multilayered electronic devices (80). The parameters of the output pulses (62) are selected to facilitate substantially uniform deposition of plating material particles explosively vaporized from a substrate (124) onto the internal wall surface (79, 126). These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz.
申请公布号 HK1001866(A1) 申请公布日期 2000.03.17
申请号 HK19980100921 申请日期 1998.02.06
申请人 ELECTRO SCIENTIFIC INDUSTRIES, INC. 发明人 OWEN, MARK, D.
分类号 B23K26/00;B23K26/38;B23K26/40;B23K101/42;C23C14/04;C23C14/28;C23C26/00;H05K3/00;H05K3/02;H05K3/40;H05K3/42 主分类号 B23K26/00
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