发明名称 CONDUCTIVE PARTICLE FOR ANISOTROPIC CONDUCTIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a good connection even if clearance between terminals to be connected varies, when the connection between the terminals is performed with anisotropic conductive adhesive. SOLUTION: This conductive particle 12 comprises a core material 13 and a metal film 14 for coating it. The core material 13 of this conductive particle 12 is made of a silica composite particle. The silica composite particle is formed by hydrolysis-condensing organic material such as divinylbenzene, styrene, acrylic, benzoguanamine, or these mixture and silica and by granulating the formed complex, and is different from material formed only by blending silica powder and binder resin. Preferably, compression bounce of the silica composite particle is 0.35 gf-3.5 gf at 20% displacement.
申请公布号 JP2000090727(A) 申请公布日期 2000.03.31
申请号 JP19980239024 申请日期 1998.08.25
申请人 SONY CHEM CORP 发明人 SAITO MASAO;YAMADA YUKIO;TAKECHI MOTOHIDE
分类号 C09J9/02;H01B1/00;H01B1/20;(IPC1-7):H01B1/00 主分类号 C09J9/02
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