| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cutting packages simply and easily from a frame board, in which a number of packages have been formed. SOLUTION: In cutting out packages 2 individually from a synthetic resin frame board 1, in which a number of surface-mounting packages 2 (consisting of an insulating protective member 2b, a resin board member 2a, and pins 2c of solder balls for leads) have been formed, each having a semiconductor element or the like mounted on a front-side surface and a number of protruded pins of miniaturized solder balls for external connections in the backside surface, the frame board 1 is placed in a water-filled tray 5 with the backside down. After the tray 5 is placed on a refrigerating chuck, the frame board 1 is fastened by having the water in the tray 5 freeze by the refrigerating chuck. Then, a rotary blade 10 detects the cutting positions and cuts out the packages individually.
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