| 摘要 |
PROBLEM TO BE SOLVED: To shorten the rinsing time and also to reduce the amount of rinsing by quickly substituting a chemical solution deposited on a wafer without causing deposition of particles. SOLUTION: A reference numeral 1 is a rinse liquid supply part 2, a rinse bath 3, a silicon wafer, 4 a wafer-holding guide, 5 a punched hole, 6 a drain liquid drain part, 7 an exhaust liquid valve respectively. A supply rate of the rinse liquid from a top of the bath is set nearly equal to the liquid exhausting rate from a bottom of the bath, so that the wafer in the rinse liquid will not expose above a liquid surface. Then the rinse liquid is also made to flow in the bath without causing stay or convection of the liquid, whereby a chemical liquid deposited on the wafer can be quickly substituted and the wafer can be rinsed without newly causing deposition of particles.
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