THIN-LAMINATE PANELS FOR CAPACITIVE PRINTED-CIRCUIT BOARDS AND METHODS FOR MAKING THE SAME

摘要

The present invention provides thin-laminate panels (i.e., thin-laminate panels (2) having dielectric layers (8) about 0.006 inches (0.15 mm) or less and conductive layers (6) on either side of the dielectric layer (8)), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. "Finishing" methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.