METHOD OF ELIMINATING PHOTORESIST LAYER IN MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method of eliminating a photoresist layer in manufacturing a semiconductor device is provided to improve an eliminating rate of a photoresist layer by changing the order of asking and stripping processes in eliminating the photoresist layer. CONSTITUTION: In a method of eliminating a photoresist layer by continuously dry-etching and wet-etching after a photo lithography, and sequentially using asking and stripping processes, the stripping process is performed prior to the asking process. Also, the asking process can be omitted in eliminating the photoresist layer.