发明名称 |
Method of Reducing the Thickness of an Electronic Circuit |
摘要 |
Disclosed is a method of reducing the thickness of an electronic circuit comprising a printed circuit and electronic components. The method includes the following operations: mounting electronic components in die form on the printed circuit, putting an insulating layer into place on the electronic components, and putting a conductive layer on the insulating layer. Various embodiments include an electronic circuit obtained by such a method; a thin plastic card, such as in a credit card format, including such an electronic circuit; and a bank card including such an electronic circuit. |
申请公布号 |
US2016381808(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201514753509 |
申请日期 |
2015.06.29 |
申请人 |
NagraID Security |
发明人 |
Guillaud Philippe |
分类号 |
H05K3/28;H05K3/14;H05K3/30 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
|
主权项 |
1. A method of reducing the thickness of an electronic circuit comprising a printed circuit and electronic components, the method comprising:
mounting electronic components in die form on the printed circuit; putting an insulating layer into place on the electronic components; and putting a conductive layer on the insulating layer. |
地址 |
Culver City CA US |