RADIO FREQUENCY INTEGRATED CIRCUIT CARD USING CONDUCTIVE ADHESIVE FILMS AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing radio frequency integrated circuit card using conductive adhesive films is provided to remove the depression possibly occurred during the printing due to a gap by not using a package and to obtain a thin and flexible card made of ductile materials since the package frame and wire are not utilized any more. CONSTITUTION: A method for manufacturing radio frequency integrated circuit card using conductive adhesive films includes the steps of adhering by heat on a lower synthetic resin(1) a middle synthetic resin formed with a cavity at one side by punching to insert a chip(3) and containing a copper foil circuit arrangement(21) on an upper part, inserting the chip in the cavity of the middle synthetic resin and fixing on the lower synthetic resin by an adhesive agent, mounting a conductive adhesive film on the middle synthetic resin for connecting the copper foil circuit and the chip to operate the circuit and adhering an upper synthetic resin(5) after filling the gap between the chip and the cavity of the middle synthetic resin and coating an adhesive agent(6) on the chip, the middle synthetic resin and the conductive adhesive film to be the same height.