| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixing structure of an electronic component in which sufficient heat dissipation properties is ensured even the size of the electronic component or the interval between a printed board and a housing is modified. SOLUTION: A heat dissipating plate 1 is interposed between a flat type electronic component Q mounted on a printed board and a heat dissipating region B while being coupled thermally. The heat dissipating plate 1 comprises a heat absorbing part 2 touching the electronic component Q and a heat dissipating leg 4 extending obliquely therefrom wherein the forward end part 4a of the heat dissipating leg 4 is brought into resilient contact with the heat dissipating region B.
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