| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket guide through which many leads of a semiconductor device can be easily and reliably inserted at once into sockets on a printed board. SOLUTION: The socket guide comprises sockets 3 provided successively with approximately fixed spacings on a printed board 4, a guide part which is disposed between the board 4 and a semiconductor device 2 having leads 6 inserted in a plurality of sockets 3 and bored for guiding a plurality of leads 6 respectively to the sockets 3, and a positioning part for positioning the guide part to the sockets 3.
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