| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board wherein the sintering property of an insulation film covering conductors formed on a board surface is improved, the electric insulation of the insulation film is improved and the shrinkage matching of the conductor with the insulation film is improved to ensure the adhesion of the conductors to the insulation film. SOLUTION: The ceramic circuit board 10 has an insulation film 5 covering at least a part of a surface conductor 2 contg. Ag as a main component formed on a board 1 surface, the insulation film 5 contains a main component meeting the range 0<=x<=0.2 as expressed by a mol ratio compsn. (1-x)MgTiO3.xCaTiO3, 3-20 wt. parts B to 100 wt. parts of the main component as converted to B2O3, 1-10 wt. parts an alkaline metal as converted to alkaline metal carbonate, 0.01-5 wt. parts Si as converted to SiO2, and 0.1-5 wt. parts an alkaline earth metal as converted to alkaline earth metal oxide.
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