| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the semiconductor chips from being twisted and degenerated due to a thermal variations, and to minimize joint error. CONSTITUTION: A semiconductor device includes a board(12), a semiconductor chip(14), and a structure(18). The semiconductor chip(14) is implemented on the board(12). The structure(18) covers at least the outer surface of the semiconductor chip(14). The structure(18) is of characteristics same to or near from a thermal expansion coefficient of the board(12). The structure(18) is bound on the surface of the semiconductor board(12) of the semiconductor chip(14). The board(12) is further made of an organic material. The structure(18) is further of a metal or an alloy material.
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