| 摘要 |
PROBLEM TO BE SOLVED: To perform normal chip area tests on all normal chip areas in a semiconductor wafer by driving all normal chips for burn-in in all chip areas for driving by enabling each chip area for driving to drive a plurality of normal chip areas for burn-in. SOLUTION: Normal chip areas 2A-2H are respectively positioned on the top side, bottom side, left side, right side, and obliquely to the upside and downside of their chip area 4 for driving in a surrounding state. The chip area 4 is electrically connected to the surrounding chip areas 2A-2H and, when the pads in the chip area 4 are probed, the chip areas 2A-2H are connected to a burn-in test circuit, and a power supply voltage and input signals are impressed upon the areas 2A-2H. Then, output signals can be fetched from the areas 2A-2H. Chip areas 5 for driving and wiring groups which connect the chip areas 2A-2H to each other cross scribing areas and are cut by dicing.
|
