| 摘要 |
PROBLEM TO BE SOLVED: To provide a rear-surface electrode type electronic part (BGA) and its fitting method with which cracks due to thermal stress or breakages due to outer stress can be prevented, and the mounting realiability of BGA be improved. SOLUTION: A solder bump electrode 2 is formed on the rear surface 5a of a substrate to which a semiconductor element is mounted, and a wiring board-side electrode is fitted onto a wiring board 6 and formed thereon. This rear-surface electrode type electronic component 1 connects the wiring board-side electrode and solder bump electrode 2. In such a component 1, a projecting insertion type terminal which is formed insertable in an insertion hole on the wiring board 6 is provided on at least one corner of the rear surface 5a, and the insertion type terminal is made of a metal, of which the melting point if higher than that of the solder bump electrode.
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