发明名称 |
ELECTRONIC COMPONENT AND METHOD AND DEVICE FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a monoblock extrusion molding for a conductive wire and kneaded material wherein the kneaded material and conductive wire are so molded to flow smoothly in parallel to extrusion direction, for stability in dimension and characteristics. SOLUTION: Related to a part where a conductive wire 4 is discharged from a conductive wire guide 7, a relationship between the size of one side inside the tip end part of the conductive wire guide 7 or inner diameter La and that outside the conductive wire 4 or outer diameter Lb is La-Lb=0.03 to 0.20 mm. Further, related to a part where one side inside such part as a mold is extruded or inner diameter Lc is formed with the same size, length Lp in extrusion direction is 1-15 mm.
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申请公布号 |
JP2000195739(A) |
申请公布日期 |
2000.07.14 |
申请号 |
JP19980367092 |
申请日期 |
1998.12.24 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
WADA SHINJI;NISHIMURA HIROHARU;FUKADA KIKUO;ISOZAKI KENZO |
分类号 |
H01F41/04;B28B3/20;(IPC1-7):H01F41/04 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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