| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency signal integrated circuit package with a simple structure which can cope with a wide band frequency. SOLUTION: A dielectrics multilayer substrate 1 where, comprising a ground layer 5 connected to a ground electrode, high-frequency signal integrated circuit parts 2 and 3 are mounted, a microstrip line 6 of conductor which, provided at the dielectrics multilayer substrate 1, comprises a wide part 6d, a frame member 7, where being fitted to the dielectrics multilayer substrate 1, an opening 7a is so formed as to enclose the integrated circuit parts 2 and 3, a lid member 8 which closes the opening 7a of the frame member 7, and a conductor 4 which, formed on both sides of the wide part 6d, is electrically connected to the wide part 6d, while electrically contacting to the ground layer 5 through the dielectrics multilayer substrate 1, are provided. Here, the dieletrics multilayer substrate 1 is provided with a waveguide part 1a comprising the wide part 6d of the microstrip line.
|
