| 发明名称 | Solid state imaging apparatus and method of producing the same | ||
| 摘要 | There is provided a solid state imaging apparatus, including: an optical film layer on which a solid state image sensor is mounted; a multifunctional chip laminated at a periphery of the solid state image sensor in the optical film layer being electrically contacted with the optical film layer via a metal body; a sealing resin layer for sealing the periphery where the multifunctional chip is laminated on the optical film layer; and a concave structure for blocking a flow of the sealing resin in a liquid state when the sealing resin layer is formed at the periphery of the sealing resin layer. Also, a method of producing the solid state imaging apparatus is also provided. | ||
| 申请公布号 | US9461082(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201414330270 | 申请日期 | 2014.07.14 |
| 申请人 | Sony Corporation | 发明人 | Maehara Masataka |
| 分类号 | H01L31/0232;H01L27/146;H01L31/0203;H01L23/00 | 主分类号 | H01L31/0232 |
| 代理机构 | Michael Best & Friedrich LLP | 代理人 | Michael Best & Friedrich LLP |
| 主权项 | 1. A solid state imaging apparatus comprising: an optical film layer on which a solid state image sensor is mounted; a multifunctional chip laminated at a periphery of the solid state image sensor in the optical film layer, the multifunctional chip electrically contacts the optical film layer via a metal body; a sealing resin layer formed with a sealing resin, the sealing resin layer for sealing the periphery where the multifunctional chip is located on the optical film layer; and a concave structure configured to retain a flow of the sealing resin in a liquid state at the periphery of the solid state image sensor. | ||
| 地址 | Tokyo JP | ||